Bond Check – Bond Testing

BONDCHECK Specification

Display

Type

5.7” (145mm), 18 bit Colour, daylight readable.

Viewable Area

115.2mm (Horizontal) x 86.4mm (Vertical). Resolution 640 x 480 pixels

Colour Schemes

User configurable Dark, Bright and Black & White.

Configurable Screen

Full Screen, Single, Dual Pane with variable size and location and function e.g. XY, Timebase.

Display Modes

Pitch-Catch, Resonance & MIA: Spot and Sweep modes. RF Timebase for Pitch-Catch only.

Graticules

None, Grid (4 sizes 5, 10, 15 and 20% FSH), Polar (4 sizes 5, 10, 15 and 20% FSH)

Offset

Spot Position: Y -50 to +50, X -65 to +65%

Flip

Manual or automatic screen orientation change to enable left or right handed use.

Transmit

Operating Mode

Pitch-Catch, Resonance and MIA.

Output Frequency Range

Pitch Catch: 5kHz to 50kHz.

Resonance: 50kHz to 400kHz

MIA: 2kHz to 10kHz

Output Voltage

Pitch-Catch tone burst: 10 ranges: 1,3,6,8,10,12,18,24,30,36V pk-pk.

Pitch-Catch sweep: 3 ranges: 12, 24, 36V pk-pk

Resonance: 3 ranges: 12, 24, 36V pk-pk

MIA: 3 ranges: 12, 24, 36Vpk-pk (high voltage drive in probe)

Minimum Output drive load impedance

300 Ohms

Waveform Type: Pitch-Catch/MIA

Tone burst with rectangular or hanning window with chirp.

Transmit waveform points maximum: 8192

Waveform duration: Maximum 3.2ms / 2.5ms

Waveform output DAC clock rate: 2.5MHz fixed

Frequency Sweep: Frequency range 5kHz to 50kHz / 2kHz to 10kHz

Waveform Type: Resonance

Fixed or swept waveform

Frequency range 5kHz to 400 kHz

Receive

Pitch-Catch / MIA Tone Burst

Sample rate: 440kHz / 100kHz

Maximum PRF: 14Hz

Sample Bit depth: 12 bit

Gain range: 0 to 60dB

Receive bandwidth: 5kHz to 100kHz -6dB points

Input voltage saturation: ±400mV

Time base range: 100μs to 2ms/ 22ms

Time base delay: 0μs to 1ms

Cross Talk: >40dB isolation

Amplitude/phase extraction cursor: position resolution <5μs /10μs

Resonance & Pitch-Catch Sweep

Dynamic Range: >150dB

Bit depth: 24 bit

Gain Range: -30 to 60dB.

Receive bandwidth: DC to 20MHz

Amplitude/phase extraction by QAM demodulation

Filtering

Fixed Hardware High-pass filter for Pitch-Catch to reduce surface scanning noise.

Fixed Hardware Low-pass filters 100kHz for Pitch-Catch for optimum amplifier SNR.

Configurable Software High-pass and Low-pass filters for all modes

Software

Acquisition Gate in RF Mode

Adjustable gate start, width and threshold.

Alarm Gate in Y-T Mode

Multiple box, circle and sector alarm zones.

Calibration Mode

Performs frequency sweep of bond and dis-bonded areas.
Automatic inspection frequency determination with manual adjustment. Air calibration for resonance mode

Bond/Dis-bond Alarm

Status on screen and probe LED.

Physical

Weight

1.2 kg, 2.7 lbs.

Size (w x h x d)

237.5mm x 144mm x 52mm / 9.4” x 5.7” x 2.1”

Material/Housing

Aluminium alloy Mg Si 0.5 powder-coated

Operating/ Storage Temperature

Operating 0 to +40 °C

Storage for up to 12 months -20 to +60 °C. Nominal +20 °C

IP Rating

54

Warranty

2 year Manufacturer’s Warranty

Covers all components of the BondCheck, excludes customer damage or misuse. (probes not included)