Bond Check – Bond Testing

Easy to use menus and icon system.

The BondCheck menu system is simple and fast to navigate. It has the ability to add individually selectable soft key menu items to the sidebar for rapid function access and a “quick-setting menu” for easy set-up, review and adjustment.

  • Support Pitch-Catch, Resonance adn MIA Bond-Testing Modes
  • Pitch and Catch Dry Coupled Bond Testing mode for rapid detection of defects in laminate, bonded and sandwich structures.
  • Automatic Test Frequency Optimisation.
  • Sweep, RF, T/T, Encoded and Phase/Frequency Plots.


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BONDCHECK Specification





5.7” (145mm), 18 bit Colour, daylight readable.

Viewable Area

115.2mm (Horizontal) x 86.4mm (Vertical). Resolution 640 x 480 pixels

Colour Schemes

User configurable Dark, Bright and Black & White.

Configurable Screen

Full Screen, Single, Dual Pane with variable size and location and function e.g. XY, Timebase.

Display Modes

Pitch-Catch, Resonance & MIA: Spot and Sweep modes. RF Timebase for Pitch-Catch only.


None, Grid (4 sizes 5, 10, 15 and 20% FSH), Polar (4 sizes 5, 10, 15 and 20% FSH)


Spot Position: Y -50 to +50, X -65 to +65%


Manual or automatic screen orientation change to enable left or right handed use.






Operating Mode

Pitch-Catch, Resonance and MIA.

Output Frequency Range

Pitch Catch: 5kHz to 50kHz.

Resonance: 50kHz to 400kHz

MIA: 2kHz to 10kHz


Output Voltage

Pitch-Catch tone burst: 10 ranges: 1,3,6,8,10,12,18,24,30,36V pk-pk.

Pitch-Catch sweep: 3 ranges: 12, 24, 36V pk-pk

Resonance: 3 ranges: 12, 24, 36V pk-pk

MIA: 3 ranges: 12, 24, 36Vpk-pk (high voltage drive in probe)

Minimum Output drive load impedance

300 Ohms


Waveform Type: Pitch-Catch/MIA

Tone burst with rectangular or hanning window with chirp.

Transmit waveform points maximum: 8192

Waveform duration: Maximum 3.2ms / 2.5ms

Waveform output DAC clock rate: 2.5MHz fixed

Frequency Sweep: Frequency range 5kHz to 50kHz / 2kHz to 10kHz


Waveform Type: Resonance

Fixed or swept waveform

Frequency range 5kHz to 400 kHz








Pitch-Catch / MIA Tone Burst

Sample rate: 440kHz / 100kHz

Maximum PRF: 14Hz

Sample Bit depth: 12 bit

Gain range: 0 to 60dB

Receive bandwidth: 5kHz to 100kHz -6dB points

Input voltage saturation: ±400mV

Time base range: 100μs to 2ms/ 22ms

Time base delay: 0μs to 1ms

Cross Talk: >40dB isolation

Amplitude/phase extraction cursor: position resolution <5μs /10μs



Resonance & Pitch-Catch Sweep

Dynamic Range: >150dB

Bit depth: 24 bit

Gain Range: -30 to 60dB.

Receive bandwidth: DC to 20MHz

Amplitude/phase extraction by QAM demodulation



Fixed Hardware High-pass filter for Pitch-Catch to reduce surface scanning noise.

Fixed Hardware Low-pass filters 100kHz for Pitch-Catch for optimum amplifier SNR.

Configurable Software High-pass and Low-pass filters for all modes




Acquisition Gate in RF Mode

Adjustable gate start, width and threshold.

Alarm Gate in Y-T Mode

Multiple box, circle and sector alarm zones.


Calibration Mode

Performs frequency sweep of bond and dis-bonded areas.
Automatic inspection frequency determination with manual adjustment. Air calibration for resonance mode

Bond/Dis-bond Alarm

Status on screen and probe LED.




1.2 kg, 2.7 lbs.

Size (w x h x d)

237.5mm x 144mm x 52mm / 9.4” x 5.7” x 2.1”


Aluminium alloy Mg Si 0.5 powder-coated

Operating/ Storage Temperature

Operating 0 to +40 °C

Storage for up to 12 months -20 to +60 °C. Nominal +20 °C

IP Rating



2 year Manufacturer’s Warranty

Covers all components of the BondCheck, excludes customer damage or misuse. (probes not included)